Huawei Ascend chips, compared
6 Huawei chip generations, 3 deployed and 3 announced, sampling or in preview. Top stated FP8: Huawei Ascend 960 at 2,000 TFLOPS per chip. Largest fixed memory entry: Huawei Ascend 950DT with 144 GB. Largest pod: Huawei Ascend 960 at 15,488 chips.
| Huawei Ascend 950DT | Huawei | In-house (HiSilicon) | — | 1441 | 41 | 1,0001 | — | — | — | — | 2,0001 | — | — | 8,1921 | Sampling | 2,0251 | 2026-11-11 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Huawei Ascend 950PR | Huawei | In-house (HiSilicon) | — | — | — | 1,0001 | — | — | — | — | 2,0001 | — | — | — | Deployed | 2,0251 | 2026-11-11 |
| Huawei Ascend 960 | Huawei | In-house (HiSilicon) | — | — | — | 2,0001 | — | — | — | — | 4,0001 | — | — | 15,4881 | Announced | 2,0251 | 2026-11-11 |
| Huawei Ascend 970 | Huawei | — | — | — | — | — | — | — | — | — | — | — | — | — | Announced | 2,0251 | 2026-11-11 |
| Huawei Ascend 910C | Huawei | In-house (HiSilicon) | SMIC N+2 (7 nm-class) | 1281 | 3.21 | — | — | — | 7521 | — | — | — | — | 3841 | Deployed | 2,0244 | 2026-11-11 |
| Huawei Ascend 910B | Huawei | In-house (HiSilicon) | SMIC 7 nm (N+2) | 641 | 1.62 | — | — | — | — | 4001 | — | — | — | — | Deployed | 2,0222 | 2026-11-11 |
Every chip in this list
All 42 chips- Huawei Ascend 950DT144 GB HiZQ 2.0 (Huawei in-house HBM) · 1,000 FP8 TFLOPS · Sampling
- Huawei Ascend 950PR1,000 FP8 TFLOPS · Deployed
- Huawei Ascend 9602,000 FP8 TFLOPS · Announced
- Huawei Ascend 970Announced
- Huawei Ascend 910C128 GB HBM · 752 BF16 TFLOPS · Deployed
- Huawei Ascend 910B64 GB HBM2e · 400 FP16 TFLOPS · Deployed