Huawei Ascend 950DT

Owner The company that specified the chip and runs it in its own cloud, data centers or products.

Huawei 1

Role What the owner says the chip is for: training, inference, both, or a general-purpose server CPU.

Training and inference 1

Design partner The ASIC house that co-designed or physically implemented the chip (Broadcom, Marvell, MediaTek, Alchip, GUC and others), as stated by the owner, the partner, a filing or named trade-press reporting. 'In-house' when the owner states it designed the chip itself, including through an acquired team such as Annapurna Labs.

In-house (HiSilicon) 1

Memory On-package memory type (HBM2e, HBM3, HBM3E, LPDDR5) or, for CPUs, the memory the socket drives (DDR5).

HiZQ 2.0 (Huawei in-house HBM) 1

Memory capacity GB On-package memory per chip in GB. Blank for CPUs, whose memory sits off-package.

144 1

Memory bandwidth TB/s Peak memory bandwidth per chip in TB/s, as published.

4 1

FP8 TFLOPS Published peak FP8 throughput per chip in TFLOPS. The precision note records sparsity where the owner states it. Blank when the owner gives no FP8 figure.

1,000 1

FP4 TFLOPS Published FP4 throughput per chip or accelerator module in TFLOPS. MXFP4 and MX4 have separate columns; see the precision note for scope.

2,000 1

Precision note What the throughput figures mean: dense or sparse, which precision, per chip or per package, and any figure the owner states only in another unit.

Same Ascend 950 die as the 950PR: 1 PFLOPS FP8 and 2 PFLOPS MXFP4 per chip. 1

Largest pod chips The largest scale-up domain the owner states: chips per pod, UltraServer, supernode or rack joined by the chip-to-chip interconnect.

8,192 1

Status Announced: public roadmap without verified deployment. Sampling: first silicon or limited internal use. Preview: customers can request early access, without a GA claim. Deployed: stated production use or general availability. Discontinued: program stopped.

Sampling 2

Announced Year the owner first announced the chip publicly.

2,025 1

Deployment scale The largest deployment the owner or a named report states: chip counts, clusters, gigawatts or regions.

Atlas 950 SuperPoD: up to 8,192 chips in 160 cabinets; volume supply expected end of 2026 or early 2027. 1

How to get it How an outside buyer can use the chip: a named cloud instance or service, a product, or 'Internal only'.

Huawei Atlas 950 SuperPoD 1

Not verified in the sources reviewed: partner basis, foundry, node, bf16, fp16, mxfp8, mxfp4, mx8, mx4, int8, power.

1. Huawei: Eric Xu keynote at Huawei Connect 2025 accessed 2026-11-11
2. TrendForce: Huawei says Ascend market share tops NVIDIA in China accessed 2026-11-11