Huawei Ascend 910B

Huawei's workhorse AI chip in China since 2023: 64 GB of HBM2e at 1.6 TB/s on SMIC's 7 nm (N+2) process, rented through Huawei Cloud and bought by Baidu, Tencent and iFLYTEK. Sources and verification dates.

Owner Huawei Status Deployed China

Verified

Open the primary source Compare side by side

Every published figure

Source per value
Owner The company that specified the chip and runs it in its own cloud, data centers or products.
Huawei 2
Role What the owner says the chip is for: training, inference, both, or a general-purpose server CPU.
Training and inference 2
Design partner The ASIC house that co-designed or physically implemented the chip (Broadcom, Marvell, MediaTek, Alchip, GUC and others), as stated by the owner, the partner, a filing or named trade-press reporting. 'In-house' when the owner states it designed the chip itself, including through an acquired team such as Annapurna Labs.
In-house (HiSilicon) 2
Foundry The fab that manufactures the die (TSMC, Samsung, SMIC, Intel).
SMIC 2
Node Process node as the owner or foundry states it, for example 'TSMC N3' or '7 nm'.
SMIC 7 nm (N+2) 2
Memory On-package memory type (HBM2e, HBM3, HBM3E, LPDDR5) or, for CPUs, the memory the socket drives (DDR5).
HBM2e 2
Memory capacity GB On-package memory per chip in GB. Blank for CPUs, whose memory sits off-package.
64 1
Memory bandwidth TB/s Peak memory bandwidth per chip in TB/s, as published.
1.6 2
FP16 TFLOPS Published FP16 throughput per chip or accelerator module in TFLOPS. See the precision note for shared-format figures, sparsity and module scope.
400 1
Precision note What the throughput figures mean: dense or sparse, which precision, per chip or per package, and any figure the owner states only in another unit.
400 FP16 TFLOPS and 64 GB HBM, stated in the Huawei Cloud co-authored DeepServe paper (USENIX ATC 2025, section 2). CSET independently estimates about 400 FP16 TFLOPS for the fastest variant; variants differ. 1
Status Announced: public roadmap without verified deployment. Sampling: first silicon or limited internal use. Preview: customers can request early access, without a GA claim. Deployed: stated production use or general availability. Discontinued: program stopped.
Deployed 2
Announced Year the owner first announced the chip publicly.
2,022 2
Deployment scale The largest deployment the owner or a named report states: chip counts, clusters, gigawatts or regions.
Bought by Baidu, Tencent and iFLYTEK (CSET, 2024). 2
How to get it How an outside buyer can use the chip: a named cloud instance or service, a product, or 'Internal only'.
Huawei Cloud; Atlas servers 2

Not verified in the sources reviewed: partner basis, bf16, mxfp8, mxfp4, mx8, mx4, fp8, int8, fp4, power, largest pod.

Sources

  1. DeepServe: Serverless Large Language Model Serving at Scale, section 2 (Huawei Cloud and Peking University) accessed 2026-11-11
  2. CSET: Pushing the limits, Huawei's AI chip tests U.S. export controls accessed 2026-11-11