Huawei Ascend 910C

Owner The company that specified the chip and runs it in its own cloud, data centers or products.

Huawei 1

Role What the owner says the chip is for: training, inference, both, or a general-purpose server CPU.

Training and inference 1

Design partner The ASIC house that co-designed or physically implemented the chip (Broadcom, Marvell, MediaTek, Alchip, GUC and others), as stated by the owner, the partner, a filing or named trade-press reporting. 'In-house' when the owner states it designed the chip itself, including through an acquired team such as Annapurna Labs.

In-house (HiSilicon) 2

Foundry The fab that manufactures the die (TSMC, Samsung, SMIC, Intel).

SMIC 1

Node Process node as the owner or foundry states it, for example 'TSMC N3' or '7 nm'.

SMIC N+2 (7 nm-class) 2

Memory On-package memory type (HBM2e, HBM3, HBM3E, LPDDR5) or, for CPUs, the memory the socket drives (DDR5).

HBM 1

Memory capacity GB On-package memory per chip in GB. Blank for CPUs, whose memory sits off-package.

128 1

Memory bandwidth TB/s Peak memory bandwidth per chip in TB/s, as published.

3.2 1

BF16 TFLOPS Published BF16 throughput per chip or accelerator module in TFLOPS. FP16 is a separate column. See the precision note for sparsity and module scope.

752 1

Precision note What the throughput figures mean: dense or sparse, which precision, per chip or per package, and any figure the owner states only in another unit.

752 dense FP16/BF16 TFLOPS across both dies (The Register); no FP8 support stated. 1

Largest pod chips The largest scale-up domain the owner states: chips per pod, UltraServer, supernode or rack joined by the chip-to-chip interconnect.

384 1

Status Announced: public roadmap without verified deployment. Sampling: first silicon or limited internal use. Preview: customers can request early access, without a GA claim. Deployed: stated production use or general availability. Discontinued: program stopped.

Deployed 3

Announced Year the owner first announced the chip publicly.

2,024 4

Deployment scale The largest deployment the owner or a named report states: chip counts, clusters, gigawatts or regions.

More than 300 Atlas 900 A3 SuperPoDs deployed for over 20 customers (Huawei, September 2025). 3

How to get it How an outside buyer can use the chip: a named cloud instance or service, a product, or 'Internal only'.

Huawei Cloud CloudMatrix 384 instances; Atlas 900 A3 SuperPoD 3

Not verified in the sources reviewed: partner basis, fp16, mxfp8, mxfp4, mx8, mx4, fp8, int8, fp4, power.

1. The Register: Stacking up Huawei's rack-scale boogeyman against Nvidia's best accessed 2026-11-11
2. TechNews: TechInsights teardown of Ascend 910C finds SMIC N+2 accessed 2026-11-11
3. Huawei: Eric Xu keynote at Huawei Connect 2025 accessed 2026-11-11
4. Reuters via Design & Reuse: Huawei, SMIC to ramp production of newest AI chip (Nov 2024) accessed 2026-11-11