Google TPU v5p

Google's performance TPU, launched in December 2023 with 8,960 chips per pod and 459 TFLOPS BF16 per chip. Google says it trains large LLMs 2.8x faster per chip than TPU v4. Sources and verification dates.

Memory95 GB
Bandwidth2.765 TB/s
FP8459 TFLOPS
BF16459 TFLOPS
Largest pod8,960 chips
Owner Google Status Deployed US cloud

Verified

Open the primary source Compare side by side

Every published figure

Source per value
Owner The company that specified the chip and runs it in its own cloud, data centers or products.
Google 1
Role What the owner says the chip is for: training, inference, both, or a general-purpose server CPU.
Training and inference 1
Design partner The ASIC house that co-designed or physically implemented the chip (Broadcom, Marvell, MediaTek, Alchip, GUC and others), as stated by the owner, the partner, a filing or named trade-press reporting. 'In-house' when the owner states it designed the chip itself, including through an acquired team such as Annapurna Labs.
Broadcom 3
Partner basis Who says so: the owner, the partner, or press reporting with the outlet named. A reported partner is not confirmed by the owner.
Reported by Reuters, citing The Information: Google has worked exclusively with Broadcom on its TPUs. No generation named; Google has not confirmed. 3
Memory capacity GB On-package memory per chip in GB. Blank for CPUs, whose memory sits off-package.
95 1
Memory bandwidth TB/s Peak memory bandwidth per chip in TB/s, as published.
2.765 1
BF16 TFLOPS Published BF16 throughput per chip or accelerator module in TFLOPS. FP16 is a separate column. See the precision note for sparsity and module scope.
459 1
FP8 TFLOPS Published peak FP8 throughput per chip in TFLOPS. The precision note records sparsity where the owner states it. Blank when the owner gives no FP8 figure.
459 1
Precision note What the throughput figures mean: dense or sparse, which precision, per chip or per package, and any figure the owner states only in another unit.
Per-chip peaks from Google's TPU v5p docs, which list 459 TFLOPS for both BF16 and FP8. HBM: 95 GiB allocatable of 96 GiB physical. 1
Largest pod chips The largest scale-up domain the owner states: chips per pod, UltraServer, supernode or rack joined by the chip-to-chip interconnect.
8,960 1
Status Announced: public roadmap without verified deployment. Sampling: first silicon or limited internal use. Preview: customers can request early access, without a GA claim. Deployed: stated production use or general availability. Discontinued: program stopped.
Deployed 1
Announced Year the owner first announced the chip publicly.
2,023 2
Deployment scale The largest deployment the owner or a named report states: chip counts, clusters, gigawatts or regions.
Salesforce and Lightricks named as early customers (Google, Dec 2023) 2
How to get it How an outside buyer can use the chip: a named cloud instance or service, a product, or 'Internal only'.
Google Cloud TPU v5p 1

Not verified in the sources reviewed: foundry, node, memory, fp16, mxfp8, mxfp4, mx8, mx4, int8, fp4, power.

Sources

  1. Google Cloud: TPU v5p accessed 2026-11-11
  2. Google Cloud Blog: Enabling next-generation AI workloads: Announcing TPU v5p and AI Hypercomputer accessed 2026-11-11
  3. Reuters (via The Star): Google preparing to partner with Taiwan's MediaTek on next AI chip, Information reports accessed 2026-11-11