Huawei Ascend 970
Huawei’s announced Ascend 970 roadmap targets training and inference, with market availability planned for the fourth quarter of 2028. Its original roadmap describes relative performance targets rather than final specifications. Sources and verification dates.
Every published figure
Source per value- Owner The company that specified the chip and runs it in its own cloud, data centers or products.
- Huawei 1
- Role What the owner says the chip is for: training, inference, both, or a general-purpose server CPU.
- Training and inference 1
- Precision note What the throughput figures mean: dense or sparse, which precision, per chip or per package, and any figure the owner states only in another unit.
- Original September 2025 roadmap targets 2x Ascend 960 FP4 compute, 2x FP8 compute, 2x interconnect bandwidth and at least 1.5x memory bandwidth. Preliminary targets, not measured throughput; absolute FLOPS remain empty. 1
- Status Announced: public roadmap without verified deployment. Sampling: first silicon or limited internal use. Preview: customers can request early access, without a GA claim. Deployed: stated production use or general availability. Discontinued: program stopped.
- Announced 1
- Announced Year the owner first announced the chip publicly.
- 2,025 1
- Deployment scale The largest deployment the owner or a named report states: chip counts, clusters, gigawatts or regions.
- Market availability planned for 2028 (Huawei, September 2026); original September 2025 target was Q4 2028. 1
Not verified in the sources reviewed: design partner, partner basis, foundry, node, memory, memory capacity, memory bandwidth, bf16, fp16, mxfp8, mxfp4, mx8, mx4, fp8, int8, fp4, power, largest pod, how to get it.
Sources
- Huawei: Eric Xu keynote, original Ascend 970 roadmap accessed 2026-11-11
- Huawei Connect 2026: Ascend 970 remains on the 2028 roadmap accessed 2026-11-11