Microsoft Maia 200

Owner The company that specified the chip and runs it in its own cloud, data centers or products.

Microsoft 1

Role What the owner says the chip is for: training, inference, both, or a general-purpose server CPU.

Inference 1

Foundry The fab that manufactures the die (TSMC, Samsung, SMIC, Intel).

TSMC 1

Node Process node as the owner or foundry states it, for example 'TSMC N3' or '7 nm'.

TSMC 3nm 1

Memory On-package memory type (HBM2e, HBM3, HBM3E, LPDDR5) or, for CPUs, the memory the socket drives (DDR5).

HBM3E 1

Memory capacity GB On-package memory per chip in GB. Blank for CPUs, whose memory sits off-package.

216 1

Memory bandwidth TB/s Peak memory bandwidth per chip in TB/s, as published.

7 1

FP8 TFLOPS Published peak FP8 throughput per chip in TFLOPS. The precision note records sparsity where the owner states it. Blank when the owner gives no FP8 figure.

5,000 2

FP4 TFLOPS Published FP4 throughput per chip or accelerator module in TFLOPS. MXFP4 and MX4 have separate columns; see the precision note for scope.

10,000 2

Precision note What the throughput figures mean: dense or sparse, which precision, per chip or per package, and any figure the owner states only in another unit.

Minimums: Microsoft states 'over 10 petaFLOPS' FP4 and 'over 5 petaFLOPS' FP8 per chip, stored here as floors of 10,000 and 5,000 TFLOPS. No BF16 figure. 272 MB on-chip SRAM, 140B+ transistors, 2.8 TB/s scale-up bandwidth; collectives span clusters of up to 6,144 accelerators. 1

Power W Chip or package power in watts as published (TDP, TBP or typical power; the source says which).

750 1

Largest pod chips The largest scale-up domain the owner states: chips per pod, UltraServer, supernode or rack joined by the chip-to-chip interconnect.

6,144 1

Status Announced: public roadmap without verified deployment. Sampling: first silicon or limited internal use. Preview: customers can request early access, without a GA claim. Deployed: stated production use or general availability. Discontinued: program stopped.

Deployed 1

Announced Year the owner first announced the chip publicly.

2,026 1

Deployment scale The largest deployment the owner or a named report states: chip counts, clusters, gigawatts or regions.

Serving Microsoft production workloads including Copilot; deploying across the US, Europe and Australia (Microsoft, Oct 2026) 3

How to get it How an outside buyer can use the chip: a named cloud instance or service, a product, or 'Internal only'.

Azure: Microsoft 365 Copilot in production; Microsoft Foundry and GitHub Copilot due by end of 2026; Maia SDK in preview 1

Not verified in the sources reviewed: design partner, partner basis, bf16, fp16, mxfp8, mxfp4, mx8, mx4, int8.

1. Microsoft: Maia 200: The AI accelerator built for inference accessed 2026-11-11
2. Microsoft: Maia 200 FP4 and FP8, stated minimums ('over 10' and 'over 5' petaFLOPS) accessed 2026-11-11
3. Microsoft: Microsoft to expand Azure Maia system to multi-gigawatt deployments accessed 2026-11-11